Timbre Technologies

Chief Executive Officer

Developed the most advanced measurement software technology, which is essential for manufacturing semiconductor chip patterns at the sub-100nm level. Timbre’s breakthrough computer software approach yields critical dimension (CD), cross sectional profile and film thickness in a single measurement. It enables precise device pattern cross-section to be generated with high repeatability in seconds.

Funded by Sevin Rosen Funds, Timbre Technologies Inc. and was acquired by Tokyo Electron Limited in February, 2001.